Density: 8.5g/cm3
Processing technique: stamping
Size: OD>5 mm * WT ≥ 0.1 mm* H > 4 mm
MOQ: 100pcs
Melting Point:2468 Degrees Celsius
Boiling Point:4742 Degrees Celsius
Delivery time: 10-15 days
Applications: Semiconductor materials, vacuum coating, sintering trays and boats, special chemical applications.
Product Feature: High melting point, high-density, high temperature oxidation resistance, long service, resistance to corrosion.